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Wakefield Thermal

658-60ABT4E

This order may require lead time

Wakefield Thermal

658-60ABT4E

HEATSINK CPU 27.9MM SQ W/ADH BLK
Specifications
Power Dissipation @ Temperature Rise 2.5W @ 30°C
Width 1.100" (27.94mm)
Length 1.100" (27.94mm)
Package Cooled BGA
Material Aluminum
Shape Square, Pin Fins
Material Finish Black Anodized
Attachment Method Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow 2.00°C/W @ 500 LFM
Type Top Mount
Fin Height 0.598" (15.20mm)

Talk to a Human: (608) 338-0082