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BOARD LEVEL HEAT SINK
Specifications
Power Dissipation @ Temperature Rise 0.6W @ 30°C
Width 0.520" (13.21mm)
Length 0.750" (19.05mm)
Package Cooled TO-220
Thermal Resistance @ Natural 35.70°C/W
Material Copper
Shape Rectangular, Fins
Material Finish Tin
Attachment Method Bolt On and PC Pin
Thermal Resistance @ Forced Air Flow 5.00°C/W @ 700 LFM
Type Board Level, Vertical
Fin Height 0.375" (9.52mm)

Talk to a Human: (608) 338-0082