|
| TE Connectivity
|
2781 |
| CONN SOCKET PLCC 20POS TIN | 20 (4 x 5) | 0.050" (1.27mm) | Tin | Phosphor Bronze | Closed Frame | - | Thermoplastic | 100.0µin (2.54µm) | Surface Mount | Solder | PLCC |
|
| TE Connectivity
|
1218 |
-
| CONN IC DIP SOCKET 24POS GOLD | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Copper Alloy | Open Frame | -55°C ~ 105°C | Polyester | 5.00µin (0.127µm) | Through Hole | Solder | DIP, 0.5 to 0.6" Row Spacing |
|
| Preci-Dip
|
848 |
-
| CONN IC DIP SOCKET 14POS GOLD | 14 (2 x 7) | 0.100" (2.54mm) | Tin | Brass | Open Frame | -55°C ~ 125°C | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Flash | Through Hole | Solder | DIP, 0.3" (7.62mm) Row Spacing |
|
| Preci-Dip
|
591 |
-
| CONN IC DIP SOCKET 32POS GOLD | 32 (2 x 16) | 0.100" (2.54mm) | Tin | Brass | Open Frame | -55°C ~ 125°C | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Flash | Surface Mount | Solder | DIP, 0.6" (15.24mm) Row Spacing |
|
| Samtec Inc.
|
505 |
| CONN IC DIP SOCKET 20POS GOLD | 20 (2 x 10) | 0.100" (2.54mm) | Tin | Brass | Open Frame | -55°C ~ 125°C | Polyester, Glass Filled | 30.0µin (0.76µm) | Through Hole | Solder | DIP, 0.3" (7.62mm) Row Spacing |
|
| TE Connectivity
|
490 |
-
| CONN IC DIP SOCKET 14POS GOLD | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Copper | Open Frame | -55°C ~ 105°C | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Flash | Through Hole | Solder | DIP, 0.3" (7.62mm) Row Spacing |
|
| TE Connectivity
|
440 |
-
| CONN SOCKET SIP 20POS GOLD | 20 (1 x 20) | 0.100" (2.54mm) | Gold | Brass | Closed Frame | -55°C ~ 125°C | Thermoplastic, Polyester | 29.5µin (0.75µm) | Through Hole | Solder | SIP |
|
| FCI Basics (Amphenol Communications Solutions)
|
335 |
| CONN SOCKET PLCC 32POS TIN | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin | Phosphor Bronze | Closed Frame | -55°C ~ 125°C | Polyphenylene Sulfide (PPS) | 150.0µin (3.81µm) | Surface Mount | Solder | PLCC |
|
| Amp-TE Connectivity
|
334 |
| CONN SOCKET PLCC 84POS TIN-LEAD | 84 (4 x 21) | 0.050" (1.27mm) | Tin-Lead | Phosphor Bronze | Closed Frame | - | Thermoplastic | - | Surface Mount | Solder | PLCC |
|
| Samtec Inc.
|
327 |
| CONN IC DIP SKT 20POS | 20 (2 x 10) | 0.100" (2.54mm) | Tin | Brass | Open Frame | -55°C ~ 105°C | Polyester, Glass Filled | - | Through Hole | Solder | DIP, 0.3" (7.62mm) Row Spacing |
|
| TE Connectivity
|
300 |
-
| CONN IC DIP SOCKET 40POS GOLD | 40 (2 x 20) | 0.100" (2.54mm) | Gold | Copper Alloy | Open Frame | -55°C ~ 105°C | Polyester | 5.00µin (0.127µm) | Through Hole | Solder | DIP, 0.6" (15.24mm) Row Spacing |
|
| Samtec Inc.
|
292 |
| CONN SOCKET PLCC 32POS TIN | 32 (2 x 7, 2 x 9) | 0.100" (2.54mm) | Tin | Beryllium Copper | Closed Frame | -55°C ~ 125°C | Liquid Crystal Polymer (LCP) | - | Surface Mount | Solder | PLCC |
|
| MILL-MAX
|
286 |
| CONN IC DIP SOCKET 40POS TIN | 40 (2 x 20) | 0.100" (2.54mm) | Tin | Brass Alloy | Open Frame | -55°C ~ 125°C | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 100.0µin (2.54µm) | Through Hole | Solder | DIP, 0.6" (15.24mm) Row Spacing |
|
| Preci-Dip
|
216 |
-
| CONN IC DIP SOCKET 40POS GOLD | 40 (2 x 20) | 0.100" (2.54mm) | Tin | Brass | Open Frame | -55°C ~ 125°C | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Flash | Through Hole | Solder | DIP, 0.6" (15.24mm) Row Spacing |
|
| Samtec Inc.
|
174 |
| CONN IC DIP SOCKET 24POS TIN | 24 (2 x 12) | 0.100" (2.54mm) | Tin | Brass | Open Frame | -55°C ~ 105°C | Polyester, Glass Filled | - | Through Hole | Solder | DIP, 0.3" (7.62mm) Row Spacing |
|
| Preci-Dip
|
158 |
-
| CONN SOCKET PLCC 44POS TIN | 44 (4 x 11) | 0.100" (2.54mm) | Tin | Phosphor Bronze | Closed Frame | - | Polyphenylene Sulfide (PPS) | - | Through Hole | Solder | PLCC |
|
| TE Connectivity
|
116 |
-
| CONN SOCKET SIP 10POS GOLD | 10 (1 x 10) | 0.100" (2.54mm) | Gold | Brass | Closed Frame | -55°C ~ 125°C | Thermoplastic, Polyester | 29.5µin (0.75µm) | Through Hole | Solder | SIP |
|
| Preci-Dip
|
46 |
-
| CONN SOCKET PGA 321POS GOLD | 321 (19 x 19) | 0.100" (2.54mm) | Tin | Brass | Open Frame | -55°C ~ 125°C | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Flash | Through Hole | Solder | PGA |
|
| TE Connectivity
|
24 |
| CONN IC DIP SOCKET 14POS TIN | 14 (2 x 7) | 0.100" (2.54mm) | Tin | Phosphor Bronze | Open Frame | -40°C ~ 105°C | - | 60.0µin (1.52µm) | Through Hole | Solder | DIP, 0.3" (7.62mm) Row Spacing |
|
| Adam Tech
|
- |
| PLCC SOCKET 44P SMT | 44 (4 x 11) | 0.050" (1.27mm) | Tin | Phosphor Bronze | Closed Frame | -55°C ~ 105°C | Thermoplastic | 80.0µin (2.03µm) | Surface Mount | Solder | PLCC |
|
| Preci-Dip
|
- |
-
| CONN IC DIP SOCKET 10POS GOLD | 10 (2 x 5) | 0.100" (2.54mm) | Tin | Brass | Open Frame | -55°C ~ 125°C | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Flash | Through Hole | Solder | DIP, 0.3" (7.62mm) Row Spacing |
|
| Preci-Dip
|
- |
-
| CONN IC DIP SOCKET 18POS GOLD | 18 (2 x 9) | 0.100" (2.54mm) | Tin | Brass | Open Frame | -55°C ~ 125°C | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Flash | Through Hole | Solder | DIP, 0.3" (7.62mm) Row Spacing |
|
| Preci-Dip
|
- |
-
| CONN IC DIP SOCKET 28POS GOLD | 28 (2 x 14) | 0.100" (2.54mm) | Tin | Brass | Open Frame | -55°C ~ 125°C | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Flash | Through Hole | Solder | DIP, 0.6" (15.24mm) Row Spacing |
|
| Preci-Dip
|
- |
-
| CONN IC DIP SOCKET 32POS GOLD | 32 (2 x 16) | 0.100" (2.54mm) | Tin | Brass | Open Frame | -55°C ~ 125°C | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Flash | Through Hole | Solder | DIP, 0.6" (15.24mm) Row Spacing |
|
| Preci-Dip
|
- |
-
| CONN IC DIP SOCKET 40POS GOLD | 40 (2 x 20) | 0.100" (2.54mm) | Tin | Brass | Elevated, Open Frame | -55°C ~ 125°C | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 29.5µin (0.75µm) | Through Hole | Solder | DIP, 0.6" (15.24mm) Row Spacing |
|
| 3M
|
- |
| CONN SOCKET CLCC 68POS GOLD | 68 (4 x 17) | 0.100" (2.54mm) | Gold | Beryllium Copper | Closed Frame | -55°C ~ 105°C | Polyphenylene Sulfide (PPS), Glass Filled | 30.0µin (0.76µm) | Through Hole | Solder | CLCC |
|
| Preci-Dip
|
- |
-
| CONN SOCKET PLCC 68POS TIN | 68 (4 x 17) | 0.100" (2.54mm) | Tin | Phosphor Bronze | Closed Frame | - | Polyphenylene Sulfide (PPS) | - | Through Hole | Solder | PLCC |
|
| 3M
|
- |
| CONN SOCKET PLCC 32POS TIN | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin | Copper Alloy | Closed Frame | -40°C ~ 105°C | Polybutylene Terephthalate (PBT), Glass Filled | 160.0µin (4.06µm) | Surface Mount | Solder | PLCC |
|
| 3M
|
- |
| CONN SOCKET PLCC 44POS TIN | 44 (4 x 11) | 0.050" (1.27mm) | Tin | Copper Alloy | Closed Frame | -40°C ~ 105°C | Polybutylene Terephthalate (PBT), Glass Filled | 160.0µin (4.06µm) | Surface Mount | Solder | PLCC |
|
| Assmann
|
- |
| CONN SOCKET PLCC 32POS GOLD | 32 (2 x 7, 2 x 9) | 0.100" (2.54mm) | Gold | Phosphor Bronze | Closed Frame | -40°C ~ 105°C | Polybutylene Terephthalate (PBT) | - | Through Hole | Solder | PLCC |
|
| Assmann
|
- |
| CONN SOCKET PLCC 44POS GOLD | 44 (4 x 11) | 0.100" (2.54mm) | Gold | Phosphor Bronze | Closed Frame | -40°C ~ 105°C | Polybutylene Terephthalate (PBT) | - | Through Hole | Solder | PLCC |
|
| Assmann
|
- |
| CONN SOCKET PLCC 84POS GOLD | 84 (4 x 21) | 0.100" (2.54mm) | Gold | Phosphor Bronze | Closed Frame | -40°C ~ 105°C | Polybutylene Terephthalate (PBT) | - | Through Hole | Solder | PLCC |
|
| Amphenol
|
- |
| CONN IC DIP SOCKET 24POS TINLEAD | 24 (2 x 12) | 0.100" (2.54mm) | Tin-Lead | Copper Alloy | Open Frame | -55°C ~ 125°C | Polyamide (PA), Nylon | 100.0µin (2.54µm) | Through Hole | Solder | DIP, 0.6" (15.24mm) Row Spacing |
|
| Samtec Inc.
|
- |
| CONN IC DIP SOCKET 8POS GOLD | 8 (2 x 4) | 0.100" (2.54mm) | Gold | Brass | Open Frame | -55°C ~ 125°C | Polyester, Glass Filled | 30.0µin (0.76µm) | Through Hole | Solder | DIP, 0.3" (7.62mm) Row Spacing |
|
| Samtec Inc.
|
- |
| CONN IC DIP SOCKET 14POS GOLD | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Brass | Open Frame | -55°C ~ 125°C | Polyester, Glass Filled | 30.0µin (0.76µm) | Through Hole | Solder | DIP, 0.3" (7.62mm) Row Spacing |