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Amphenol

DILB24P-223TLF

This order may require lead time

Amphenol

DILB24P-223TLF

CONN IC DIP SOCKET 24POS TINLEAD
Specifications
Number of Positions or Pins (Grid) 24 (2 x 12)
Pitch 0.100" (2.54mm)
Contact Finish Tin-Lead
Contact Material Copper Alloy
Features Open Frame
Operating Temperature -55°C ~ 125°C
Housing Material Polyamide (PA), Nylon
Contact Finish Thickness 100.0µin (2.54µm)
Mounting Type Through Hole
Termination Solder
Type DIP, 0.6" (15.24mm) Row Spacing

Talk to a Human: (608) 338-0082